BlackBerry Z10 拆解后主要部件来自 Qualcomm和Samsung！

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      据tomshardware报道，BlackBerry Z10主要部件是28nm的双核1.5GHz的高通CPU和Qualcomm MSM8960芯片组，该芯片组可以支持3G and 4G LTE；还有三星提供的2 GB RAM 模块和16 GB内置闪存. 做工和用料还是一贯的严谨！值得信赖！具体如下：
    Samsung K3PE0E000A - Multichip Memory - 2 GB Mobile DDR2 SDRAM
) Y. W! I6 O, s* p# n% w) T    Samsung KLMAG2GE4A - Multichip Memory - 16 GB MLC NAND Flash, Controller
5 x/ O& O) {, h- [- ]- H% I    Qualcomm MSM8960 - Snapdragon S4 Baseband / Applications Processor
7 g, m; N3 g$ g/ r0 ~/ L3 x    Qualcomm WCD9310 - Audio Codec
/ O2 K5 i5 d8 R3 W& ^! b    Qualcomm PM8921 - Power Management IC
    Qualcomm RTR8600 - GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS
0 |& J; Q& l* m9 @$ f3 E! q9 }. Z3 S    Texas Instruments WL1273L - Single-Chip 802.11a/b/g/n WLAN, Bluetooth, and FM
    TriQuint TQP6M9017 - Dual-Band WLAN Module
$ P2 Q2 q# k# P: C" O3 Z, x+ w    RF Micro Devices RF7252 - CDMA/WCDMA BAND 2 Linear Power Amplifier Module
  R# j4 Z- S$ d9 E- r9 S, h    RF Micro Devices RF7303 - LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module
- s# Y3 G* z% K& Y9 t6 e# Q+ J7 A    Inside Secure SECUREAD IC5C633I4- NFC Solution Module
    Avago ACPM-5017 - LTE Band XVII Power Amplifier
  {" J+ X4 N; }5 |    Avago ACPM-7051 - Quad-Band GSM / W-CDMA Bands I & V Power Amplifier
    Sony CXM3582UR - SP10T Antenna Switch
    ST Microelectronics LIS3DH - MEMS Accelerometer
. H6 {7 G# ]' H  j. ~/ a4 Y    ST Microelectronics LSM330DLC - 3D Accelerometer & 3D Gyroscope
5 u. l6 M1 e% q    Synaptics Clearpad 3203 - Capacitive Touchscreen Controller
4 @1 V4 G0 Z! K: f4 `- j

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做工和用料还是一贯的严谨！值得信赖！

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