|
TREO PRO HTC 的Service Manual,包括装配,拆机,刷机,简单故障分析等内容,很详细
& `2 t, d b! L2 Y9 e: k" q1 c! Z+ v& h+ L% b2 r
原帖地址已经不记得了,无非就是那么几个论坛的。我看到有人在找,就转上来。2 o0 y* q! b/ P/ e* @$ l+ ?
全英文的,不过难度不大,光看图也基本可以看明白的。, r5 S" |! l1 |; n8 j# O
# W. |9 a. G" I A3 N. z
Table of Contents* c# x, h% W6 O9 G
CHAPTER 1 INTRODUCTION······································································································································4& G! {! B% R6 G+ ~
CHAPTER 2 PRODUCT SPECIFICATIONS·················································································································4
" Y% p8 c; b. \4 TCHAPTER 3 SERVICING EQUIPMENT AND TOOLS ·································································································9
1 h* d2 ~- \/ j6 Y) D; L7 WCHAPTER 4 ASSEMBLING AND DISASSEMBLING·································································································11
/ M, x6 c* q) @! o: U) b) Q4.1 DEBUG FIXTURE ·············································································································· 11+ N7 s- O/ \' e, u$ U
4.2 DISASSEMBLING ·············································································································· 12
* t; c2 x/ h6 H- ?4.3 ASSEMBLING··················································································································· 22% C3 M1 Q; w9 p5 l) c9 x) M" p
CHAPTER 5 DIAGNOSTIC PROGRAM······················································································································35
! u! w5 i3 T' y5.1 HOW TO ENTER BOOT-LOAD MODE···················································································· 35, H" L" S, U; v
5.2 HOW TO MAKE DIAGNOSTIC CARD ····················································································· 37' u5 @1 `6 m- ?' s4 }
5.3 HOW TO ENTER DIAGNOSTIC PROGRAM ············································································ 38
& P. F) ?5 P9 ^0 n4 k: S$ [. R( s5.4 LIST OF DIAGNOSTIC TEST ITEMS······················································································· 40
8 I! C1 e" L6 i$ u. R5.5 HOW TO PERFORM THE OS UPGRADING PROCESS VIA MICRO-SD CARD?····························· 41
# @3 f& u/ i6 f7 ?& YCHAPTER 6 DEVICE CURRENT CONSUMPTION MEASURE ················································································43
: z4 e' r3 Q7 t% Q2 JCHAPTER 7 TROUBLE SHOOTING GUIDE··············································································································46) y1 Z& P2 l- q$ A" T' t
7.1 IDENTIFY REPORTED FAILURE SYMPTOM BEFORE REPAIR····················································· 46, @. \6 r% R2 ]3 S5 h
7.2 HOW TO PERFORM WARM BOOT AND COLD BOOT······························································ 48
1 T0 Z( z$ l3 a7 k- \+ E( |& _7.3 TROUBLE SHOOTING PROCESS/FAULTY TREE····································································· 49
8 p* F: I4 U& i/ Y' nCHAPTER 8 LABELING PLAN (NOT READY)···········································································································65
% e0 m& t* A% i) U0 O2 ]# }9 o) Z8.1 AGENCY LABEL- T850UEU······························································································ 65, f8 Q# t1 y; h" ?
8.2 AGENCY LABEL-T850UNA ······························································································ 67, n, i9 K- l; R. g& ~& Y, m
CHAPTER 9 LCM INSPECTION CRITERIA (FOR NEW LCM)··················································································68
# k. ^, Q. d1 @& D! K- ?! B2 qCHAPTER 10 SPARE PARTS LIST AND PHOTO······································································································70" ^) M- t( `1 X; w0 I
10.1 PHOTOS OF SPARE PARTS ······························································································ 70
) y* G8 L9 j' w. s6 r1 ZCHAPTER 11 BOARD LEVEL REPAIR ······················································································································72
3 B. y2 P0 @: z: X( o$ j, F) g11.1 EQUIPMENT AND HAND TOOLS························································································· 72, U, r4 d) {/ c) z5 b% `
11.2 MAIN BOARD KEY COMPONENT BLOCK: ··········································································· 73
& {% x* w2 ?* I! z11.3 WLAN/ BT/GPS TROUBLE SHOOTING PROCESS······························································ 76. O- z+ S; K) d7 H6 K: K" D& A4 d
NOTIFICATION ONCE PERFORMING GOLDEN CAP REPLACEMENT ················································ 816 E7 p- H* A" u! `1 A% K2 F, V! J
UNDERFILL RE-WORK PROCESS······························································································ 82 |
|