看到有人找这个，我就转发上来, HTC的TREO PRO 资料

jiangxc

TREO PRO HTC 的Service Manual，包括装配，拆机，刷机，简单故障分析等内容，很详细
5 }$ T2 z% h! U* t8 ]9 ]4 M  @: a) t
原帖地址已经不记得了，无非就是那么几个论坛的。我看到有人在找，就转上来。
, r* m5 v( ?# G% |: W" s& t+ r) }+ O全英文的，不过难度不大，光看图也基本可以看明白的。

Table of Contents
+ A; `; P' m0 W. n/ jCHAPTER 1 INTRODUCTION······································································································································4
CHAPTER 2 PRODUCT SPECIFICATIONS·················································································································4
& V8 }$ L- V9 K* y) ECHAPTER 3 SERVICING EQUIPMENT AND TOOLS ·································································································9
2 J0 x! O! [5 o2 W4 ~/ R2 R% CCHAPTER 4 ASSEMBLING AND DISASSEMBLING·································································································11
4.1 DEBUG FIXTURE ·············································································································· 11
4.2 DISASSEMBLING ·············································································································· 12
4.3 ASSEMBLING··················································································································· 22
CHAPTER 5 DIAGNOSTIC PROGRAM······················································································································35
5 k7 V# f, `$ g3 Z  D5 a1 L5.1 HOW TO ENTER BOOT-LOAD MODE···················································································· 35
5.2 HOW TO MAKE DIAGNOSTIC CARD ····················································································· 37
; R7 Z( a# q( C: a& o( _0 H( I5.3 HOW TO ENTER DIAGNOSTIC PROGRAM ············································································ 38
3 @/ j7 l- v% A5.4 LIST OF DIAGNOSTIC TEST ITEMS······················································································· 40
5.5 HOW TO PERFORM THE OS UPGRADING PROCESS VIA MICRO-SD CARD?····························· 41
CHAPTER 6 DEVICE CURRENT CONSUMPTION MEASURE ················································································43
% v+ T& |/ J1 `( MCHAPTER 7 TROUBLE SHOOTING GUIDE··············································································································46
7.1 IDENTIFY REPORTED FAILURE SYMPTOM BEFORE REPAIR····················································· 46
7.2 HOW TO PERFORM WARM BOOT AND COLD BOOT······························································ 48
7.3 TROUBLE SHOOTING PROCESS/FAULTY TREE····································································· 49
4 ?7 J; ?9 `( {/ F$ YCHAPTER 8 LABELING PLAN (NOT READY)···········································································································65
8.1 AGENCY LABEL- T850UEU······························································································ 65
6 E4 ?) t, z. o" J3 p8.2 AGENCY LABEL-T850UNA ······························································································ 67
CHAPTER 9 LCM INSPECTION CRITERIA (FOR NEW LCM)··················································································68
* w& s# `  c0 m  Q/ W) b3 G! RCHAPTER 10 SPARE PARTS LIST AND PHOTO······································································································70
10.1 PHOTOS OF SPARE PARTS ······························································································ 70
CHAPTER 11 BOARD LEVEL REPAIR ······················································································································72
11.1 EQUIPMENT AND HAND TOOLS························································································· 72
11.2 MAIN BOARD KEY COMPONENT BLOCK: ··········································································· 73
11.3 WLAN/ BT/GPS TROUBLE SHOOTING PROCESS······························································ 76
NOTIFICATION ONCE PERFORMING GOLDEN CAP REPLACEMENT ················································ 81
& t4 Q) Z  G: @- e  k/ uUNDERFILL RE-WORK PROCESS······························································································ 82

jiangxc

没人顶啊，沙发自己坐。

gb312

顶你up。。。。。

珍和

好东西啊，大哥连这个都找到了啊……

jiangxc

不好意思，这个资料论坛原本就有的，我只是重发了一次而已。

燃灯道人

一本维修手册

HTC用的仪器是固伟的,比较经济

麒麟王

标记下,回头下载看看