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TREO PRO HTC 的Service Manual,包括装配,拆机,刷机,简单故障分析等内容,很详细
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原帖地址已经不记得了,无非就是那么几个论坛的。我看到有人在找,就转上来。+ I3 r) U- y- B; z! |0 @, y+ w
全英文的,不过难度不大,光看图也基本可以看明白的。
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Table of Contents) k& r0 [6 M9 C- y2 k
CHAPTER 1 INTRODUCTION······································································································································4
1 a O" y% D( LCHAPTER 2 PRODUCT SPECIFICATIONS·················································································································4
% L7 r6 T5 V! N2 cCHAPTER 3 SERVICING EQUIPMENT AND TOOLS ·································································································9
; i8 p7 Z6 m" u; ~9 H gCHAPTER 4 ASSEMBLING AND DISASSEMBLING·································································································11
2 H6 d1 r @3 h' U8 J4.1 DEBUG FIXTURE ·············································································································· 11: V3 q, h$ s6 W( H8 _
4.2 DISASSEMBLING ·············································································································· 12, \- ^% p3 A2 L6 W) R- Q" l7 Y
4.3 ASSEMBLING··················································································································· 22- B1 J9 O' q X7 u6 \7 L* o8 Q! C# u
CHAPTER 5 DIAGNOSTIC PROGRAM······················································································································35
4 J0 G* y: y9 p9 i1 S. K, a* Z, M5.1 HOW TO ENTER BOOT-LOAD MODE···················································································· 35" R( u; ?% T- _6 _7 q& `* ]/ O
5.2 HOW TO MAKE DIAGNOSTIC CARD ····················································································· 375 O8 Z1 O' q* u1 N4 S$ I" L6 S
5.3 HOW TO ENTER DIAGNOSTIC PROGRAM ············································································ 38* i2 P/ G+ z. b% \( U' D9 L5 C$ z g9 x
5.4 LIST OF DIAGNOSTIC TEST ITEMS······················································································· 407 A9 B- X$ g$ Q& Z- O# a u/ e
5.5 HOW TO PERFORM THE OS UPGRADING PROCESS VIA MICRO-SD CARD?····························· 41
; J4 {- B: d- S& H8 r8 ECHAPTER 6 DEVICE CURRENT CONSUMPTION MEASURE ················································································43* K1 J2 l' |( O9 r1 F8 G% n
CHAPTER 7 TROUBLE SHOOTING GUIDE··············································································································46
& P# B$ d( I5 V: Z9 Y7.1 IDENTIFY REPORTED FAILURE SYMPTOM BEFORE REPAIR····················································· 46
) L( |6 N5 u0 D3 X" m8 E1 Q, h7.2 HOW TO PERFORM WARM BOOT AND COLD BOOT······························································ 48( {7 G- }7 d; h9 J3 ^& ^7 K% I4 \
7.3 TROUBLE SHOOTING PROCESS/FAULTY TREE····································································· 49" Q X- I: D7 H: B9 m. k
CHAPTER 8 LABELING PLAN (NOT READY)···········································································································65
+ r8 d( ?8 d1 k. p3 F( E8.1 AGENCY LABEL- T850UEU······························································································ 65
* V4 U' L x' c: l% j8.2 AGENCY LABEL-T850UNA ······························································································ 67# g$ u! r2 q/ t7 g
CHAPTER 9 LCM INSPECTION CRITERIA (FOR NEW LCM)··················································································68
6 j4 P6 p4 S# b7 F. DCHAPTER 10 SPARE PARTS LIST AND PHOTO······································································································70' ?, v' \" r* D7 D' A
10.1 PHOTOS OF SPARE PARTS ······························································································ 70/ [6 C3 L {4 O, V. h
CHAPTER 11 BOARD LEVEL REPAIR ······················································································································72
: G+ n0 w) y, q5 w3 H, q11.1 EQUIPMENT AND HAND TOOLS························································································· 72
" e% s& r% a E+ F7 ^( p: R- }11.2 MAIN BOARD KEY COMPONENT BLOCK: ··········································································· 73; T/ I6 X/ ?0 p0 U7 M4 Q
11.3 WLAN/ BT/GPS TROUBLE SHOOTING PROCESS······························································ 76) r5 A. Q- a. W* W8 g4 h+ l: }
NOTIFICATION ONCE PERFORMING GOLDEN CAP REPLACEMENT ················································ 81
, Y2 x" L0 z5 o: }4 ^! F bUNDERFILL RE-WORK PROCESS······························································································ 82 |
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